Ultra FE SEM - Ultra high resolution Field Emission Scanning Electron Microscopy FIB - Focused Ion Beam Milling OM - Optical Microscopy Electron Spectroscopy for Chemical Analysis can be used to analyze very thin layers (as thin as mono layers) on sample surfaces. ESCA provides qualitative and quantitative analysis of elements. It can also determine how those elements are chemically bound together. Typical applications include metals, electronic materials, thin films, optical coatings, passivation coatings, surface chemistry verification, surface chemistry of polymers and metallized, or otherwise surface treated, plastics, and corrosion studies. STEM - Scanning Transmission Electron Microscopy
Ultra FE SEM can be used to show the surface structure and morphology of nanoscale materials at magnifications up to 800,000x. Low kV imaging can be used to nondestructively reveal surface features without coating your sample, even on very tough samples.
Typical applications include biopolymers, optical coatings, nanomaterials, nanoscale microelectronics, passivation coatings and fine powders.
Focused ion Beam (FIB) milling can expose buried layers or defects in multilayer stacks for subsequent identification and analysis. FIB will also image and measure coating and layer thickness.
Typical applications include microelectronics, bioelectronics, optical coatings, passivation coatings and anti-wear coatings on metals.
FE-SAM - Field Emission Scanning Auger Microanalysis
FE-SAM can be used to identify buried layers or defects in multilayer stacks. SAM also depth profiles through multilayer materials and coatings to show inter diffusion between the layers or the presence of contamination between the layers, for subsequent identification and analysis.
Typical applications include microelectronics, bioelectronics, optical coatings, passivation coatings, anti-wear coatings on metals, biocompatibility coatings, switch contacts and film delamination.
SEM/EDS - Scanning Electron Microscopy/Energy Dispersive X-ray Spectroscopy
SEM/EDS is used find and identify inclusions, contamination and defects in bulk materials as well as analyze the composition of the bulk material itself. In addition, the distribution of elements can be mapped across surfaces showing elemental diffusion or migration and the distribution of additives and fillers.
Typical applications include metal components, microelectronics, bioelectronics, optical coatings, passivation coatings, metal parts and castings, metals, biocompatibility coatings, switch contacts, film delamination and material fracture analysis.
FTIR - Micro Fourier Transform Infrared Spectroscopy
FTIR is used to identify inclusions, contamination and defects in polymeric materials as well as the composition of the bulk polymer itself. In addition, FTIR can identify the composition of multilayer plastics and the distribution of additives and fillers. Micro liter and bulk extractions can made and analyzed to determine the cleanliness of parts and the efficacy of in-process cleaning procedures. Specialized measurements of contaminants in semiconductor wafers, to quantitative measurements of trace surface organics, to identification of biological materials, and others can be obtained through FTIR.
Typical applications include polymer products, metal components, microelectronics, biomaterials, optical coatings, passivation coatings, paints, adhesives and film delamination.
XM - X-ray Microscopy
X-ray microscopy can be used to image voids, inclusions and components within materials and samples. It can be used to nondestructively measure part features and dimensions and to screen for incorrect assembly or other defects within packaged parts prior to final shipment.
X-ray microscopy can also be used to image and record on video, the workings of electromechanical devices, pumps, switches and surgical implements; showing why good ones work and defective parts fail.
Typical applications include switches, relays, arthroscopic implements, catheters, syringes, pumps, products, and mechanical devices.
Optical microscopy is used to image, measure and count voids, inclusions and components in samples. Advances in software allow optical microscopes to image over samples larger than a foot long at high magnifications while stitching the images together into a seamless panorama which can be printed at lengths up to ten feet long.
Other features allow the imaging of very rough samples, like fractured metal parts, with the production of photographs that have every detail in the fracture surface in focus at the same time.
ESCA - Electron Spectroscopy for Chemical Analysis
Scanning Transmission Electron Microscopy can be used to image structure and very thin layers within samples. STEM is often used in conjunction with FIB for submicron and nanoscale microelectronics imaging.
Typical applications include microelectronics, thin films, optical coatings and metallized plastics.
AFM/SPM - Atomic Force Microscopy/Scanning Probe Microscopy
Atomic Force Microscopy/Scanning Probe Microscopy can be used to image surface morphology and measure surface roughness from nanometers to microns, on a variety of materials.
Typical applications include microelectronics, thin films, optical coatings, biomedical coatings, metal surface finishes, honed, electropolished and/or coated knife edges and gratings.